- AI-Driven Hydrogen Technology Innovation Center (hydro*studio)
- AI-Space Solar Initiative
- InnoCORE Research Center for Semiconductor PAckaging Co-Physics DEsign Framework(SPACE-F)
- Bio-MAX Innocore Research Center
- Intelligent Defense Systems Research Group
- Safe AI Research Center
- Center for AI-Based Precision Control of Hematologic Malignancies
- AI-Convergent Consciousness Research Cente
- Mechanics-grounded Physical AI Initiative (M-PAI Initiative)
- Space Exploration Basic Research Center
- MarinE Pollution CarbOn Upcycling Circular Chemistry Center
InnoCORE Research Center for Semiconductor PAckaging Co-Physics DEsign Framework(SPACE-F)
KEYWORDKeyword
OBJECTIVE Objective
● Develop AI-driven Co-Physics design technologies integrating multi-physics (optical, thermal, structural, and dynamic domains)
● Establish a unified design framework linking design–process–measurement–analysis data in real time
● Achieve breakthrough yield and precision in next-generation packaging using glass and heterogeneous substrates
● Cultivate globally competitive InnoCORE Fellows as key research assets
INTRODUCTION Director's Message
Greetings.
I am Taesung Kim, Director of the SPACE-F Research Center for Semiconductor Packaging Co-Physics Design Framework.
As front-end process scaling approaches its physical limits,
semiconductor packaging has emerged as the decisive battleground
for next-generation system competitiveness.
Yet the complex challenges of today's advanced packaging—where
optics, thermal, structural, and dynamic phenomena are deeply intertwined—can
no longer be addressed through fragmented, single-physics approaches.
SPACE-F was founded to confront this challenge head-on.
Our mission is to integrate multiphysics interactions across optics, thermal,
structural, and dynamic domains within a unified AI Co-Physics framework,
and to leverage this foundation to revolutionize the yield and
reliability of next-generation glass substrate packaging.
Beyond the technology itself, we are equally committed to cultivating
25 InnoCORE Fellows as world-class interdisciplinary researchers
who will carry this vision forward and shape the future of Korea's semiconductor industry.
Thank you.
Prof. Taesung Kim, Director, SPACE-F
IMPACT Impact
Address key multiphysics challenges in semiconductor packaging and secure core technologies
Improve industrial productivity and yield through integrated design–process–equipment frameworks
Strengthen domestic semiconductor ecosystem and technological independence
Build a national talent pipeline through InnoCORE Fellow development
TALENT Ideal Talent
Interdisciplinary researchers capable of integrating multiphysics, AI, and process design
to solve complex engineering problems, with strong independence and industrial applicability